中文 An inspection company

Wafer Thickness, TTV, Bow and Warpage

handles 25 micron wafers

ALTO-TTV family offers the speedy measurement of wafer geometry parameter, more importantly, we can automate the tool to handle from thin wafers to perforated, warped, bumped, and tape-framed wafers. optional sorter and shipping jar unpacking function available.

 

measurement specification

specification

wafr thickness wafer ttv
speed of measurement 3 sec <20 sec
range of measurement 25-1000 microns  
accuracy 0.25 microns 0.05 micron
repeatability 0.10 microns 0.02 micron

Multi-functional

non-contact, high reliability measurement

ALTo-TTV automatic measuring system is economic, small foot-print with multiple hardware and metrology optins to meet each customers requirement

TTV MEASUREMENT

Illustraed picture (LEFT) is a TTV map of 200mm Silicon Wafer. TTV is acquired by measuring the capacitance with a propreitary Resonance Method. Single Sensor 1000 points used the , TTV = 6.70 micron

SUBSTRATE RESISTANCE MEASUREMENT

Aside from wafer thick ness and ttv, the tool has options to measure the edge of a wafer, check the conductivities (N/P) and the substrate resistance as the 3D map shows (Left)

 

Profiling

delicate wafers

When wafers get fragile and automation is a must for production need. alto-ttv is the choice that can help you deal with the delicate wafers.

  • from Si, sapphire, to compound wafers
  • wafer thickness, Total thickness variations (TTV)
  • warp, bow, sag
  • wafer edge profiling
  • resistance
  • conductivity (P/N)

Questions?

write to us if you have any questions or you would like to request technical details or arrange a demo..

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